Multi-Layer Compound Passivation and Dual-P Diffusion Enhanced Si Power Diode Performance

نویسندگان

چکیده

Power diode with multi-layer compound passivation and dual-P typed diffusion are studied manufactured. Combine multiple advantages, a power reverse breakdown voltage higher than 2200V, static on-resistance 1.11Ω leakage current of 8.3mA can be obtained on silicon drift layer thickness 280um resistivity 60Ωcm. Simulation shows multilayer polysilicon contact effectively change the edge carrier distribution, thus reducing transverse generation improving withstand. Inserting light deep aluminum doped into PIN increase withstand by more 16% through expanding depletion layer. And moat structure device further reduce peak electric field, risk breakdown. This used in switching supply inverter.

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ژورنال

عنوان ژورنال: Advances in transdisciplinary engineering

سال: 2022

ISSN: ['2352-751X', '2352-7528']

DOI: https://doi.org/10.3233/atde220506